Custom Round Circuit Board Assembly for Smart Device Solutions

• Customization: Available
• Metal Coating: Tin
• Mode of Production: SMT
• Model NO.: FONIETO-1
• Base Material: FR-4
• Certification: RoHS, CCC, ISO, Ts16949
• Customized: Customized
• Condition: New
• Solder Resist Color: Green;Red;Yellow;Black;White
• Order Qty: No Limited
• Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg
• Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask
• Transport Package: Inner Vacuum Packing Outer Carton Box
• Specification: FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
• Trademark: OEM, ODM
• Origin: China
• HS Code: 8534009000
• Production Capacity: 100000pieces/Year

Product Description

 

Delivery time	Samples	5pcs ~ 100pcs	1 Day	All the above time starts after all components and PCB materials are ready
	Small batch	101pcs ~ 5000 pcs	3 Days
	Medium batch	5001pcs ~ 10000 pcs	5 Days
	Large batch	>10001pcs	15 Days
Production capacity	SMT 2 million points/day; DIP 250,000 points/day; 5-10 models/day
Component Range	Min. 01005(0.4mm*0.2mm) Max. 55mm(H25mm)
PCB Size	Min. 50mm*50mm (Suggest >100mm*100mm) Max. 460mm*1200mm
Max. Thickness	The batch size is not more than 3 mm, and the model is unlimited
Placement Accuracy	+/- 40micrometer (Chip)  +/- 30micrometer (IC)
PCB Types	PCB rigid board (FR-4, metal substrate), PCB flexible board (FPC), soft and hard PCB
File Format	Bill of Materials (BOM), PCB files (Gerber files and PCB design format files), coordinate files
Solder paste tin wire tin bar	Lead-free solder paste, customed solder paste, Brand solder paste
Steel Mesh	Laser stencil IC and BGA components can reach PC-2 Class
Component Packaging	We accept SMT components in reel, cutting tape, tube, tray, etc. which can be packed on the machine. DIP components can be packed in bulk.
Component Purchase Service	1 Foundry only (Customers provide PCB and components)                                                                                          2 Part of the substitute materials (customers provide core components and special components, we can purchase other components on behalf of us)                                                                                 3 A full set of substitute materials (reduce purchase cost and communication cost)
Test	1, IQC: Incoming inspection 2,IPQC: In-production inspection 3, Visual QC: regular quality inspection 4,On-line AOI: Check the soldering effect of solder paste, SMD components, few parts or component polarity. 5, X-Ray:Check BGA, QFN and other high-precision hidden PAD components. 6,Test function and performance according to customer's test procedures and steps. 7,  Aging test: According to the customer's test time for aging.